Categories

ADD: Roomb403, Qitushidai Building, No.14 Huoju Road, Xi'an City, China

P.C.: 710043

TEL: 86-029-88130156/88130159

FAX: 86-029-88130157

E-mail: sales@tungsten-metals.com

Contact Person: Ms.Dilys Yue

Website: www.tungsten-metals.com

www.metal-tungsten.com

Home > News > Content

Molybdenum Metal Has Good Thermal Stability

Molybdenum metal can be used as a catalyst in the chemical industry and in the petroleum industry; molybdate can be used as a pigment and a dye, and is added to the molybdenum oxide in the electronics industry. Enamel can make enamel and steel combined firmly; molybdenum dioxide can be used as a solid lubricant.

Molybdenum metal is mainly used in the electronics industry, Molybdenum Metals a large number of high-temperature electric furnace for the heating materials and structural materials, vacuum tube of large electrodes and gate, Molybdenum Metals semiconductor and electric light source materials. Due to the thermal neutron trapping of molybdenum and a high lasting strength, can also be used as nuclear reactor structural materials.

Molybdenum metal used as a high-temperature electric furnace heating materials and structural materials, vacuum tube of large electrodes and gate, semiconductor and electric light source materials. Molybdenum Metals Due to the thermal neutron trapping of molybdenum and a high lasting strength, can also be used as nuclear reactor structural materials.

The thermal conductivity of the molybdenum metal [135 watts / (m-open)] is the best match for specific heat [0.276 kJ / kg / g], making it a natural choice for thermal shock and thermal fatigue. Molybdenum Metals It has a melting point of 2620 ° C, which is inferior to tungsten and tantalum, but the density is much lower, so its specific strength (strength / density) is greater than that of tungsten and tantalum, Molybdenum Metals and in applications where weight is critical effective. Molybdenum still has a high strength at 1200 ℃.

Molybdenum metal with high melting point, high strength, high hardness, low resistivity characteristics. Molybdenum metal high temperature resistance, impact resistance, wear resistance, good thermal stability, to ensure the stability of the device under high temperature conditions, MEMS devices manufacturing materials for the manufacture of a good choice, especially for high temperature and other harsh or extreme surroundings. Traditional molybdenum materials are formed by physical or chemical deposition. Molybdenum Metals If you can use molybdenum metal materials as a structural material to replace the traditional monocrystalline silicon silicon material to produce MEMS switches, MEMS resonators, MEMS probe cards and other devices, due to the characteristics described earlier, these devices will have more excellent electrical, mechanical And high temperature and other characteristics. Molybdenum metal is one of the most commonly used EDM electrode materials, molybdenum metal material through the micro-processing tool to form microelectrode, can be used for micro-EDM; compared with copper and other fine metal electrode materials, molybdenum metal material microelectrode wear rate Low processing durability, high processing precision, Molybdenum Metals can effectively improve the processing quality and stability. Due to the high density of molybdenum metal and other properties, the traditional reactive ion etching process has a very low etching rate and a large lateral etching, and can not achieve large depth and high aspect ratio in a relatively short time Corrosion, can not meet the manufacturing requirements of MEMS devices. Therefore, the current application of molybdenum metal in the integrated circuit process, Molybdenum Metals through physical or chemical deposition method to prepare a layer of less than 2 microns thin film, and then use the traditional reactive ion etching process to process them to prepare the device Such as metal grids, metal interconnections, metal diodes, etc., the use of etching gas or gas combination involving CF4, CF4 + 02, Cl2, Cl2 + 02, SF6, SF6 + 02, NF3, CCl4 + 02, etc. (PEI), reactive plasma etching (RIE), electron cyclotron resonance plasma etching (ECR), etc., due to the relatively low plasma density (less than IOici-IO12cnT3), low energy, The resulting etch rate is generally much less than 1 micron per minute. At present, there is no report about the use of molybdenum metal materials as the main structure of the preparation of MEMS devices, and the existing molybdenum etching process rate is generally low, Molybdenum Metals anisotropy becomes the main bottleneck. Applicable to the processing of molybdenum metal materials, can achieve high rate, high aspect ratio of the etching process has not been reported.


Previous: No Information

Next: Copper Tungsten Has Good Thermal Conductivity